L. Min, H. Kwon, S Vaziri, X Bao, M Asheghi, K. E. Goodson, “Thermal Management of 3D Chips and Monolithic Integrated Circuits Using Phase Change Materials-Si/Cu Composites,” Journal of Electronic Packaging (2025).

D. Kong, R. Giglio, M.R. Shattique, Q. Wu, H. Kwon, J.W. Palko, H. Lee, E.M. Dede, M. Asheghi, K.E. Goodson, “Development of a capillary-driven two-phase microcooler using copper wiremesh 3D manifold and silicon micropin fin wicks,” International Journal of Mechanical Sciences, 305 (2025).

D. Kong, H. Kwon, H. Lee, H. Lee, M. Asheghi, K. Goodson, “Computational Fluid Dynamics Modeling and Optimization of Large-Scale (3 cm × 3 cm) Silicon-Based Embedded Microchannels with 3D Manifold Micro-Coolers,” Journal of Electronic Packaging (2025). 

H. Su*, H. Kwon*, F. Xue, N. Sato, U. Bhat, W. Tsai, M. Bosman, M. Asheghi, K. E. Goodson, E. Pop and S. Wang, "Thermal Characterization of Ultrathin MgO Tunnel Barriers," Nano Letters, 24, 46 (2024).

Q. Wu, H. Kwon, M. Asheghi and K. E. Goodson, "Design of Manifolded 3-D μ-Coolers Enabling High Heat Flux Capillary-Driven Boiling Over Large Areas," IEEE Transactions on Components, Packaging and Manufacturing Technology, 14, 8, 1367-1373 (2024).

S. Vaziri, C. Perez, I. M. Datye, H. Kwon, C. F. Hsu, M. E. Chen, M. Noshin, T. Y. Lee, M. Asheghi, W. Y. Woon, E. Pop, K. E. Goodson, S. S. Liao and X. Bao, "AlN: An Engineered Thermal Material for 3D Integrated Circuits," Advanced Functional Materials (2024).

H. Su, H. Kwon, W. Hwang, F. Xue, Ç. Köroğlu, W. Tsai, M. Asheghi, K. E. Goodson, S. X. Wang and E. Pop, "Thermal optimization of two-terminal SOT-MRAM," Journal of Applied Physics, 136, 1, (2024).

M. Noshin*, H. Kwon*, A. I. Khan*, S. P. Alaei, C. Meng, M. Asheghi, Y. Suzuki, S. Salahuddin, K. Goodson and S. Chowdhury, "Probing the Thermal and Electrical Properties of Ultrawide Bandgap Nitrogen‐Polar AlGaN Heterostructures," Advanced Functional Materials, 34, 39, (2024).

Y. Lin, H. Kwon, H. Chen, M. P. Gupta, M. Degner, M. Asheghi, H. A. Mantooth and K. E. Goodson, "Development of a Hybrid Capillary-Driven Single-Phase and Two-Phase Micro-Cooler for Power Electronics Cooling," IEEE Transactions on Components, Packaging and Manufacturing Technology, 14, 5, 810-823 (2024).

H. Kwon, Q. Wu, D. Kong, S. Hazra, K. Jiang, S. Narumanchi, H. Lee, J. W. Palko, E. M. Dede, M. Asheghi and K. E. Goodson, "Capillary-enhanced two-phase micro-cooler using copper-inverse-opal wick with silicon microchannel manifold for high-heat-flux cooling application," International Communications in Heat and Mass Transfer, 156, (2024).

D. Kong, H. Kwon, B. Jang, H.-J. Kwon, M. Asheghi, K. E. Goodson and H. Lee, "Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels," Energy Conversion and Management, 315, (2024).

Y. Wang*, D. W. Collinson*, H. Kwon, R. D. Miller, K. Lionti, K. E. Goodson and R. H. Dauskardt, "Linking Interfacial Bonding and Thermal Conductivity in Molecularly-Confined Polymer-Glass Nanocomposites with Ultra-High Interfacial Density," Small, 19, 28, 2301383 (2023).

J. Zhou*, Y. Wu*, H. Kwon, Y. Li, X. Xiao, Y. Ye, Y. Ma, K. E. Goodson, H. Y. Hwang and Y. Cui, "Heat Conductor-Insulator Transition in Electrochemically Controlled Hybrid Superlattices," Nano Letters, 22, 13, 5443-5450 (2022).

C. Perez, A. Jog, H. Kwon, D. Gall, M. Asheghi, S. Kumar, W. Park and K. E. Goodson, "Dominant Energy Carrier Transitions and Thermal Anisotropy in Epitaxial Iridium Thin Films," Advanced Functional Materials, 32, 45, (2022).

A. I. Khan, X. Wu, C. Perez, B. Won, K. Kim, P. Ramesh, H. Kwon, M. C. Tung, Z. Lee, I. K. Oh, K. Saraswat, M. Asheghi, K. E. Goodson, H. P. Wong and E. Pop, "Unveiling the Effect of Superlattice Interfaces and Intermixing on Phase Change Memory Performance," Nano Letters, 22, 15, 6285-6291 (2022).

A. I. Khan, H. Kwon, M. E. Chen, M. Asheghi, H. S. P. Wong, K. E. Goodson and E. Pop, "Electro-Thermal Confinement Enables Improved Superlattice Phase Change Memory," IEEE Electron Device Letters, 43, 2, 204-207 (2022).

H. Kwon, C. Perez, W. Park, M. Asheghi and K. E. Goodson, "Thermal Characterization of Metal-Oxide Interfaces Using Time-Domain Thermoreflectance with Nanograting Transducers," ACS Applied Materials and Interfaces, 13, 48, 58059-58065 (2021).

H. Kwon, C. Perez, H. K. Kim, M. Asheghi, W. Park and K. E. Goodson, "Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition," ACS Applied Materials and Interfaces, 13, 18, 21905-21913 (2021).

H. Kwon, A. I. Khan, C. Perez, M. Asheghi, E. Pop and K. E. Goodson, "Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films," Nano Letters, 21, 14, 5984-5990 (2021).

G. A. Sevison, S. Farzinazar, J. A. Burrow, C. Perez, H. Kwon, J. Lee, M. Asheghi, K. E. Goodson, A. Sarangan, J. R. Hendrickson and I. Agha, "Phase Change Dynamics and Two-Dimensional 4-Bit Memory in Ge2Sb2Te5 via Telecom-Band Encoding," ACS Photonics, 7, 2, 480-487 (2020).

Y. Kim*, H. Kwon*, H. S. Han*, H. J. K. Kim, B. S. Y. Kim, B. C. Lee, J. Lee, M. Asheghi, F. B. Prinz, K. E. Goodson, J. Lim, U. Sim and W. Park, "Tunable Dielectric and Thermal Properties of Oxide Dielectrics via Substrate Biasing in Plasma-Enhanced Atomic Layer Deposition," ACS Applied Materials and Interfaces, 12, 40, 44912-44918 (2020).

A. I. Khan, H. Kwon, R. Islam, C. Perez, M. E. Chen, M. Asheghi, K. E. Goodson, H. S. P. Wong and E. Pop, "Two-Fold Reduction of Switching Current Density in Phase Change Memory Using Bi₂Te₃ Thermoelectric Interfacial Layer," IEEE Electron Device Letters, 41, 11, 1657-1660 (2020).

P. Guo, J. A. Burrow, G. A. Sevison, H. Kwon, C. Perez, J. R. Hendrickson, E. M. Smith, M. Asheghi, K. E. Goodson, I. Agha and A. M. Sarangan, "Tungsten-doped Ge2Sb2Te5 phase change material for high-speed optical switching devices," Applied Physics Letters, 116, 13, (2020).

K. W. Jung, S. Hazra, H. Kwon, A. Piazza, E. Jih, M. Asheghi, M. P. Gupta, M. Degner and K. E. Goodson, "Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling," Journal of Electronic Packaging, 142, 3, (2020).

A. Sood, R. Cheaito, T. Bai, H. Kwon, Y. Wang, C. Li, L. Yates, T. Bougher, S. Graham, M. Asheghi, M. Goorsky and K. E. Goodson, "Direct Visualization of Thermal Conductivity Suppression Due to Enhanced Phonon Scattering Near Individual Grain Boundaries," Nano Letters, 18, 6, 3466-3472 (2018).

1. Y. Lin, H. Kwon, Y. He, H. Chen, M. P. Gupta, M. Degner, M. Asheghi, H. A. Mantooth and K. E. Goodson, "Capillary-based two-phase cooling for high power density power electronics," ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Jose, CA, USA (2024)

2. Y. Lin, H. Kwon, H. Chen, M. P. Gupta, M. Degner, M. Asheghi, H. A. Mantooth and K. E. Goodson, "The Impact of Liquid Supply Delivery Methods on the Thermal Performance of a Capillary-based Two-phase Micro-cooler for the Power Electronics," 2024 23th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Aurora, CO, USA (2024)

3. H. Kwon, Q. Wu, D. Kong, S. Hazra, K. Jiang, C. Ahn, S. Narumanchi, H. Lee, J. Palko, E. M. Dede, M. Asheghi and K. E. Goodson, "Development of a Hybrid Single/Two-phase Capillary-Based Micro-Cooler using Copper Inverse Opals Wick with Silicon 3D Manifold for High-Heat-Flux Cooling Application," 2024 23th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Aurora, CO, USA (2024)

4. H. Kwon, D. Kong, H. Lee, J. Palko, E. M. Dede, M. Asheghi and K. E. Goodson, "Scalable large-area two-phase capillary-enhanced micro-cooler using silicon microchannel fin array with 3D silicon manifold for high-heat-flux electronics cooling application," ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Jose, CA, USA (2024)

5. K. Jiang, H. Kwon, H. Qiao, Y. He, M. Asheghi and K. E. Goodson, "High-precision thermal characterization of ultra-low thermal resistance copper nano-wire (CUNWS)-polydimethylsiloxane (PDMS) composite thermal interface materials (TIMS) tape," ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Jose, CA, USA (2024)

6. K. Jiang, H. Kwon, H. Qiao, Y. He, M. Asheghi and K. E. Goodson, "Fabrication and Thermal Characterization of Copper Nanowires (CuNWs) Thermal Interface Materials Tapes," 2024 23th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Aurora, CO, USA (2024)

7. Q. Wu, Z. Gong, C.-Y. Chan, H. Kwon, K. Goodson and T. Wei, "Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement," ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Diego, CA, USA (2023)

8. S. Vaziri, I. M. Datye, E. Ambrosi, A. I. Khan, H. Kwon, C. H. Wu, C. F. Hsu, J. Guy, T. Y. Lee, H. S. P. Wong and X. Y. Bao, "First Fire-free, Low-voltage (~1.2 V), and Low Off-current (~3 nA) SiOxTey Selectors," 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Honolulu, HI, USA (2022)

9. M. C. Tung, A. I. Khan, H. Kwon, M. Asheghi, K. E. Goodson, E. Pop, H. S. P. Wong, E. M. Panning and J. A. Liddle, "Nanoscale phase change memory arrays patterned by block copolymer directed self-assembly," Novel Patterning Technologies 2022, (2022)

10. A. I. Khan, C. Perez, X. Wu, B. Won, K. Kim, H. Kwon, P. Ramesh, K. M. Neilson, M. Asheghi, K. Saraswat, Z. Lee, I.-K. Oh, H. S. Philip Wong, K. E. Goodson and E. Pop, "First Demonstration of Ge2Sb2Te5-Based Superlattice Phase Change Memory with Low Reset Current Density (~3 MA/cm2) and Low Resistance Drift (~0.002 at 105°C)," 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Honolulu, HI, USA (2022)

11. K. W. Jung, S. Hazra, H. Kwon, A. Piazza, E. Jih, M. Asheghi, M. P. Gupta, M. Degner and K. E. Goodson, "Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm2) Power Electronics Cooling," ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Anaheim, CA, USA (2019)

12. J. A. Burrow, P. Guo, G. A. Sevison, H. Kwon, C. Perez, M. Asheghi, J. R. Hendrickson, A. Sarangan, K. E. Goodson and I. Agha, "Optical and electrical properties of phase change materials for high-speed optoelectronics," 2019 Conference on Lasers and Electro-Optics (CLEO), San Jose, CA, USA (2019)

13. C. L. M. Everhart, K. E. Kaplan, M. M. Winterkorn, H. Kwon, J. Provine, M. Asheghi, K. E. Goodson, F. B. Prinz and T. W. Kenny, "High stability thermal accelerometer based on ultrathin platinum ALD nanostructures," 2018 IEEE Micro Electro Mechanical Systems (MEMS), (2018)

A.I. Khan, H. Kwon, R. Islam, H.-S. P. Wong, K. E. Goodson, M. Asheghi, E. Pop, “Low-Power Phase Change Memory Technology with Interfacial Thermoelectric Heating Enhancement” US Utility Patent, Application Number: 17/498369 (2021)

H. Kwon, Q. Wu, S. Hazra, M. Asheghi, K. E. Goodson, E. M. Dede, J. Palko, H. Lee, D. Kong, “MICRO-COOLER ASSEMBLIES” US Utility Patent, Application Number: 18/952162 (2025)

Y. Lin, H. Kwon, M. Asheghi, K. E. Goodson, “Hybrid capillary-driven phase-change micro-cooler having passive coolant recirculation” US Utility Patent, Application Number: 18/042817 (2025)