We investigates the fundamentals of heat and mass transfer to engineer next-generation thermal management solutions. Our research spans from uncovering nanoscale heat conduction in electronic devices to developing advanced liquid cooling systems for 2.5D/3D heterogeneous packaging. Our mission is to engineer scalable and commercially viable thermal management architectures that extend the performance limits of semiconductor devices for AI and power electronics, while significantly enhancing the energy efficiency of data centers to contribute to global sustainability.