We investigate the fundamentals of heat/mass transfer and invent next-generation thermal management solutions from a mechanical engineering perspective. Our research spans from uncovering nanoscale heat conduction in nano-electronics to developing advanced cooling systems for 2.5D/3D heterogeneous chip packaging and HPC data centers, and pioneering emerging thermal engineering fields.

Our ultimate mission is to implement scalable and commercially viable thermal management architectures that extend the performance limits of semiconductor devices to advance AI and power technologies, while significantly enhancing the energy efficiency of thermal management systems to play a pivotal role in realizing global sustainability.