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Capillary-based two-phase heat sink and system level design for energy-efficient data center
Capillary-based two-phase heat sink and system level design for energy-efficient data center
Embedded liquid micro-cooler for highly integrated System-on-Chip (SoC) microsystems
Embedded liquid micro-cooler for highly integrated System-on-Chip (SoC) microsystems
Thermal conduction in heterogeneous chip packages for AI and power electronics applications
Thermal conduction in heterogeneous chip packages for AI and power electronics applications
Time-resolved and high-spatial-resolution thermal characterization of heterogeneous thin-film systems
Time-resolved and high-spatial-resolution thermal characterization of heterogeneous thin-film systems
Physics-informed machine learning for phase-change heat transfer in porous media
Physics-informed machine learning for phase-change heat transfer in porous media
Advanced packaging process development and integration for high-heat-flux 3D semiconductor devices
Advanced packaging process development and integration for high-heat-flux 3D semiconductor devices
Hybrid solid-state heat engine/pump devices using X-caloric materials
Hybrid solid-state heat engine/pump devices using X-caloric materials
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