We investigate the fundamentals of heat and mass transfer and invent next-generation thermal management solutions from a mechanical engineering perspective. Our research spans from uncovering nanoscale heat conduction in electronic devices to developing advanced liquid cooling systems for 2.5D/3D heterogeneous chip packaging. Our ultimate mission is to implement scalable and commercially viable thermal management architectures that extend the performance limits of semiconductor devices for AI and power electronics, while significantly enhancing the cooling energy efficiency to contribute to global sustainability.